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Authors Journals w Keywords
s
+\ 4 A.Venema Abe, T. Abe, Takashi Abell, Chris Abeln, G.C. Abramovich, H. Abramson, A.R. Abril, Josep F. Abu-Threideh, Jane Acharya, T.
Adachi, S. Adams, J. D. Adams, Mark D. Adams, Mark L. Adams, S.G. Adrian, R.J. Agarwal, Gunjan Ahmed, H.
Ahn, C. H. Ahn, C.H. Ahn, Chong H
Ahn, Chong H.
Ahn, D. J. Ahn, Sang Jung Ahn, Sang-Jung
Aigner, R. Ajdari, Armand Akamine, S. Akamine, Shinya Akiyama, Ryo Akiyama, T. Akiyama, Terunobu
Albaugh, K.B. Albrecht, T.R. Albrecht, Thomas R. Alderman, J. Ali, Feroze Ali, M. Ben Alkoy, Sedat
Allameh, S.M. Allan, R.S. Allen, J.J. Allen, M.G. Allen, Mark G.
Allen, S.A.B.
Allmen, P von AllonsoAmigo, MG Aloni, S. Aluru, N.R. Aluru, Narayan Amanatides, Peter Amaratunga, Gehan Amro, Nabil A.
An, Huijin ANDERSON, D.J. Anderson, J. R. Anderson, R.C. Anderson, W. French Andersson, J.Y. Ando, S.
Andreolia, C.
Androva, N.A. Angell, J.B. Angell, James B. Angus, John C. Annovazzi-Lodi, V. Anthamatten, O. Antonsson, E.K. Arai, M. Arana, L.R. Aref, H. Arima, M.
Armani, D.
Armani, Deniz Armiento, C.A. Arndt, K.-F.
Asaoka, A.
Asaoka, N. Asheghi, M. Ashurst, W. Robert
Ashurst, W.R. Askraba, S. Aslam, D.M. Assente, R. Ataka, M.
Atalar, A.
Audoly, C. Austin, Robert H. Autumn, Kellar Avouris, Ph. Avouris, Phaedon
Awe, Aderonke Ayazi, F.
Ayliffe, H.E.
Ayon, A.A. Azzam Yasseen, A. Baba, Yoshinobu Babin, S. Bacci, A. Bachand, George D. Bachelder, David M.
Bacher, W. Backlund, Y. Baden, Holly
Badi, M.H. Badolato, Antonio
Badt, Dirk Bae, Byunghoon Baert, K. Bagdahn, J.
Bai, Y. B. Bakajin, Olgica Balasubramanian, Ashwin Balberg, M. Baldi, A. Baldini, F. Baldwin, Danita Baldwin, K. Baldwin, K. W. Ballard, Stanley S.
Balles, H. Ballew, Richard M. Balog, R.P.
Baltes, H. Banfield, Jillian F.
Bang, C.A. Bang, D. D. Bannon, F.D. Bannon, F.D., III
Bar-Cohen, Y. Bar-Cohen, Yoseph Barbastathis, G.
Barber, B. Barber, B.P.
Barbic, M. Barnstead, Mary Barrett, R. C.
Barrett, R.C.
Barron, A. Barron, Annelise Barron, Annelise E. Barrow, Ian Barry, V. Barth, Friedrich G. Barth, Phillip W. Barzilai, A. Bashir, Rashid Basu, Rajiv
Batt, Carl A.
Battig, R. Bauer, J. M. BAUER, JOSEPH M. Baughn, T.V. Baughn, Terry V. Baumgartel, H. Baumhueter, Suzanna Baxter, G.W. Bayburt, Timothy H. Baynes, Nde.B. Beal, David N.
Bean, K.E. Beasley, Ellen Beaucage, G.
Beavis, A.
Beavis, A. J. Bebcock, D. Becher, D
Beck, P.A.
Becker, H.
Becker, T.
Beckman, K.J.
Bedekar, A.S. Beebe, D. J. Beebe, D.J. Beebe, David J.
Beeson, Karen Belanger, Marie-Claire Belaubre, P. ( Y Y Y z z Y x > @ 2 x
B B 2 ` 2 Y Y @ Z > z I > *
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H AATCC Review Advanced Materials Advanced Packaging, IEEE Transactions on [see also Components, Packaging and Manufacturing Technology, Part B: Advanced Packaging, IEEE Transactions on] Advanced Packaging, IEEE Transactions on [see also Components, Packaging and Manufacturing Technolog Anal. Chem. Analytical Biochemistry Analytical Chemistry ,)Angewandte Chemie - International Edition $ Annals of Biomedical Engineering 4/Annu. Rev. Biomed. Eng. Annu. Rev. Biomed. Eng. 0-Annu. Rev. Mater. Sci. Annu. Rev. Mater. Sci. $!Annual Review of Material Science Applied Physics Letters (%ASCE Journal of Aerospace Engineering 85ASME Journal of Manufacturing Science and Engineering Biochemistry Biomaterials \YBiomedical Engineering, IEEE Transactions on Biomedical Engineering, IEEE Transactions on Biomedical Microdevices Biosensors and Bioelectronics ,(Chemical Journal of Chinese Universities Chemical physics letters Chemical Reviews Chemistry Letters ChemPhysChem ,&Chinese Journal of Inorganic Chemistry Chinese Physics Letters Components and Packaging Technologies, IEEE Transactions on [see also Components, Packaging and Manufacturing Technology, Part A: Packaging Technologies, IEEE Transactions on] Components and Packaging Technologies, IEEE Transactions on [see also Compone 82CRC Critical Review Solid States Materials Science $ Current Opinion in Biotechnology Elecktronik Praxis Electrical Insulation, IEEE Transactions on [see also Dielectrics and Electrical Insulation, IEEE Transactions on] Electrical Insulation, IEEE Transactions on [see also Dielectrics and Electrical Insulation, IEEE Transactions on] PMElectron Devices, IEEE Transactions on Electron Devices, IEEE Transactions on Electronics Letters Electrophoresis Experimental Cell Research Experimental Mechanics Experiments in Fluids Ferroelectrics Hewlett-Package Journal ,'IBM Journal of Research and Development IEE Proceedings IEEE Control Systems Magazine 41IEEE Engineering in Medicine and Biology Magazine IEEE Journal of MEMS 83IEEE Journal Selected Topics in Quantum Electronics 4.IEEE Microwave and Wireless Components Letters $!IEEE photonics technology letters IEEE Sensors Journal ,)IEEE Transaction on Electrical Insulation ($IEEE Transaction on Electron Devices 0-IEEE Transactions on Antennas and Propagation (%IEEE Transactions on Electron Devices 83IEEE Transactions on Instrumentaion and Measurement 84IEEE Transactions on Instrumentation and Measurement $ IEEE Transactions on Magnetics 84IEEE Transactions on Microwave Theory and Techniques ,&IEEE Transactions on Power Electronics 0,IEEE Transactions on Robotics and Automation <9IEEE Transactions on Systems, Man, and Cybernetics Part B @;IEEE/ASME Journal of Microelectromechanical Systems (JMEMS) ,&IEEE/ASME Transactions on Mechatronics \YIndustrial Electronics, IEEE Transactions on Industrial Electronics, IEEE Transactions on Ink World Inorganic Chemistry $!International Journal of Fracture ,(International Journal of Multiphase Flow 0-International Journal of RF and Microwave CAE
J. Chem. Educ (#Journal of Electrochemical Society (#Journal of Americal Ceramic Society ($Journal of American Chemical Society (%Journal of American Chemistry Society
< &mu (100) Si wafer (100) Si wafers (111)-oriented silicon wafer -1.8 to 1.8 micron -7.66 dB
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0 to 140 V 0 to 150 micron 0 to 240 kPa 0 to 250 kPa 0 to 35 kPa 0 to 60 kPa
0 to 7 bar 0.0015 ohmcm
0.1 micron 0.2 MPa 0.2 ms 0.2 to 0.3 micron 0.2 to 0.5 micron
0.2 to 25 mus 0.3 to 2 MHz 0.33 atm 0.34 micron 0.35 A 0.4 T 0.42 micron 0.5 W
0.6 micron 0.7 mum
0.8 micron 1 A 1 cm/s to 1 m/s 1 GHz 1 h 1 kHz 1 kV 1 micron 1 mm 1 MPa 1 mum 1 to 10 micron
1 to 10 nm 1 to 100 nm 1 to 20 MHz 1 to 20 torr 1 W 1-octadecanethiol 1.0 mm 1.02 kHz 1.2 A 1.2 atm 1.2 eV 1.2 kPa
1.2 micron 1.2 mm
1.4 micron 1.5 kHz 1.5 mohm 1.5 mW 1.5 nm 1.5 to 3.5 micron 1.5 V
1.6 micron 1.7 kHz
1.8 mohmcm 1.9 V 1/f noise 1/f noise suppression 10 Gbit 10 Hz 10 kHz 10 mA 10 MHz 10 micron 10 min 10 mtorr 10 mW 10 s to 48 day 10 to 30 mohmcm 10 to 30 nm 10 to 34 micron 10 to 400 h 10.0 micron 10.6 micron 100 Hz 100 Hz to 10 kHz 100 Hz to 14 kHz 100 Hz to 2 MHz 100 m 100 mA
100 micron 100 ms 100 mum 100 mW 100 nm 100 psi 100 to 150 micron 100 to 180 degC 100 to 600 micron 100 V 100> 1000 degC 1000 torr 1064 nm 11 kHz 11.7 to 12.7 kHz 110 C 110 nm 1100 degC 116 year 118 day 12 mohm 12 mum 12 to 100 nm 12 V 120 mum 120 to 210 micron 1200 C 128 C 13 muV 13000 h 135 K 140 to 5 micron 1400 K 15 GHz 15 micron 150 C
150 micron 150 to 350 micron 150 W 1500 to 2000 &mu 16 micron 16-mercaptohexadecanoic acid 16.2 Hz 160 to 360 micron 170 C 170 degC 170 muW 173 to 373 K 18 kHz 18 micron
18 to 100 kHz 18 V 180 mA 180 mW 1800 K 19.3 kPa 190 mT 1D sliding motion 1D static analysis ,)1H,1H,2H,2H-perfluorodecyltrichlorosilane 1st paper on piezoresistivity 2 A 2 Gbit 2 kHz 2 MHz 2 micron 2 mm 2 mum 2 to 20 micron 2 to 25 V
2 to 3 micron 2 to 3 mm 2.2 ms to 50 mus 2.23 kHz 2.3 MHz
2.3 micron 2.3 V 2.5 kHz
2.5 micron 2.5 mW 2.6 mm 2.7 kHz 2.7 micron/s 20 fA 20 micron 20 mum 20 ns 20 to 100 micron 20 to 320 K 20 to 600 C 200 mA
200 micron 200 nm 200 to 1000 micron 200 to 350 degC
200 to 800 nm 2000 MIPS 2000 torr 21 kHz 22.4 mohm 24 hour 25 Hz 25 micron 25 mtorr 25 to 35 micron 25 to 350 micron 250 Hz 250 muW 250 to 4000 micron 255 nm 2600 MPa 27.3 micron 28 V 284 day 2D arrays 2D diffusion ($2D electrostatic torsion micromirror 2D lattice gas model ("2D triaxial contact stress profile 3 atm 3 micron 3 mm 3 to 5 ms $ 3-D micromolded channel network 3.2 kHz 3.3 kHz 3.33 Pa 3.4 W
3.5 micron 3.5 pF 30 C 30 micron 30 min 30 nm
30 to 200 kPa 30 to 50 ms 30 to 90 MHz 300 C 300 degC
300 micron 300 to 1200 angstrom 300 V 3000 micron
310 micron 32 C 32.0 dB 320 degC 33 mW 33 V 340 kHz 35 micron 35 mohm 35.3 to 3.7 kHz 37 degC 377 Pa 38 micron 3986 Hz @ 8 x 8 3 M ? 7 H j B e @ L 6 E c / ] 0 7 S f u v = Y F a w d # J q K ^ _ W a $ | w " * b h m k < @ ? > o ; T N : D 8 - G I \ ] P n 5 x n ` g C ~ ( ) T p 9 z + { } i ; r s : p l f @ 8 @ c @ O9 per LL4.2i < 5 http://mass.micro.uiuc.edu/publications/papers/84.pdfy' 1Micro and Nanotechnology Laboratory, University of Illinois at Urbana-Champaign, Urbana, IL, 61801
2Department of Chemistry, Northwestern University, Chicago, ILators, Sensors, and Systems Group, Micro and Nan Iverson, Terry Iwata, N. J G Eden, S-J Park, N P Ostrom, S T McCain, C J Wagner, B A Vojak, J Chen, C Liu, P von Allmen, F Zenhausern, D J Sadler, C Jensen, D L Wilcox and J J Ewing J. Chen, J. Engel, N. Chen, and C. Liu, "A Monolithic Integrated Array of Out-of-Plane Hot-Wire Flow Sensors and Demonstration of Boundary-Layer Flow Imaging," 18th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2005, Miami Beac ,(J. Engel, J. Chen, D. Bullen, and C. Liu J. Engel, J. Chen, Z. Fan, and C. Liu, "Polymer Micromachined Multimodal Tactile Sensors," Sensors and Actuators A: Physical, vol. 117, no. 1, pp. 50-61, January 3, 2005. 82J. Zou, M. Balberg, C. Byrne, C. Liu, and D. Brady J.E. Schutt-Ain Jachimowicz, Artur
Jackman, R.J. Jackman, Rebecca J.
Jackson, K.M. Jacobs, Heiko O. Jacobsen, Claus J. H. Jacobson, J.M. Jacobson, Stephen C.
Jadaan, O. Jaeger, Luc Jaeger, Richard C. Jagannath, C.J. Jagannathan, H. Jager, Edwin W. H.
Jagota, A.
Jang, Jaesung Jang, Joonkyung Jansen, H.V.
Javey, Ali Jayachandran, J.P. Jayaraman, Sundaresan
Jenkins, J.W. Jensen, B.D. Jensen, C Jensen, K.F. Jensen, Klavs F.
Jerman, H. Jerman, J.H. Ji, H. Ji, Jin
Ji, Rui-Ru Jian-Hui, Liao Jiang, F. Jiang, F.K. Jiang, Hongrui Jiang, Linan
Jiang, Xin
Jiang, Xingyu
Jin, Xuecheng Jo, B.-H. Jo, B.H. JO, BYUNG-HO Joachim, C. Joachim, Daphne Johansson, Stefan John, Pamela M. St. Johnson, B. Johnson, Brian N. Johnson, J. Johnson, Jeffery Johnson, John E.
Johnson, W.A.
Jolic, K I Jones, A.R. Jones, B. E.
Jones, D K Jones, D.K.
Jones, Darren Jones, Douglas Jones, Douglas L. Jones, P.E. Jonnalagadda, K. Joonkyung, Jang Joseph, Eric Jr., John Ransford Davis Jr., William D. Callister Ju, Ming-Shaung
Judy, J.W. Judy, M. W. Judy, Michael W. Judy, Michael Warren
Jun, Yongseok Juncker, D.
Jung, Erik
Jung, Hyungil Jung, Young Mee
Kaajakari, V. KABEI, Nobuyuki KAGAMIBUCHI, Hideki Kahn, H.
Kahn, J.M. Kahrizi, M. Kaiser, W.J.
Kaldor, S. Kallenbach, Matthias Kaltsas, G. Kalush, Francis
Kalvesten, E.
Kamholz, A.E.
Kamins, T. I. Kamins, T.I. Kamins, Ted Kamins, Theodore I. Kanda, Yozo
Kane, B.J. Kaneo Mohri Kang, S. Kang, S.-M.
Kang, S.M.
Kang, Sung-Mo Kang, Weng Poo Kanger, J.S. Kaplan, David L. Kapoor, S.G. Kappert, H. Kappes, Manfred M. Karaman, M.
Karihaloo, B. Karim, A. Karimi, Kambiz
Karlak, Brian Kastantin, Mark Kattelus, Hannu Kaviany, M. Kawabata, Akira Kawahata, K. Kawamura, Y. Kawasaki, H.
Kawase, T. Ke, C.
Ke, Zhaoxi Keasling, J.D. Kedzierski, Jakub
Kee, Hongseok Kejariwal, Anish Keller, Chris G.
Kelley, W. Kelly, J.J. Kelly, K. Kelly, K.W. Kelly, Matt Kelly, S. Kempa, K. Kenis, Paul J. A. Kenny, T. Kenny, T. W. Kenny, T.W. Kenny, Thomas W. Keplinger, Franz Keppner, H. Kerbage, C. Kerns, David V.
Kerr, D.R.
Kerr, Emma L comb electrostatic drives comb fingers comb overlap amount comb-drive actuators comb-drive resonator combinatorial technique 0,combined surface/bulk micromachining process
combustion common mode deflection common-mode pressure communication and control
compatibility compensation compensation structure completely wetting substrate complex 3-D channel paths complex mixtures complex tunable filters
compliance Compliant component positioning Composite composite material composite materials composite membrane composite plate stiffness compositional uniformity compound flexure compression bonding compressive bending loads compressors computation operations computational approach computational fluid dynamics <6Computer assistance for persons with handicaps [C7850] Computer simulation $ computer-aided fluid simulation computing Condensation condenser microphone condenser microphones Conductance microscopes Conducting polymers conduction cooling conduction mass shift conductive film conductive fluid environment conductive liquids conductive polymers conductive substrate conductivity monitoring ("conductivity-based contact sensing conductor wire cone and plate viscometer
cone angle confined bonding region confocal laser imaging conformal coatings conformal film deposition 0*conformal hydrophobic fluorocarbon coating conformal mapping conformal polymer coating CoNiMnP CoNiMnP-based arrays connective tissue connector holes
constant flux constant force constant heat flux model constant-flow modes constituent equations constrained thermal expansion constrained volume reservoir constriction microchannels construction
contact angle
contact cycle contact forces contact metal pad contact mode contact pressure contact resistance contact resistances contact sticking contact time contact-Inking DAcontamination-insensitive differential capacitive pressure sensor (#continuous conductance oscillations continuous electrowetting continuous pumping continuous rotor rotation 41continuously-varying three-dimensional structures contrast ratio control bandwidths control circuitry control mechanism control methods $ controllable bubble dissipation 0*controllable bubble formation temperatures controllable damping ("controllable microbubble actuation controllable microbubbles $ controllable x-y displacements controlled air flow controlled gaps fabrication controlled stepwise motion convection cooling convex edges cooling coplanar waveguides
copolymers copper
copper alloys coring procedure Coriolis force corner-cube retroreflectors corrosion HCCorrosion, oxidation, etching, and other surface treatments [A8160] corrugated diaphragm corrugated membrane actuators corrugation profile Coulomb charging effects coupling efficiencies
coupling loss coupling spring dimensions covalent conjugation Cr Cr-W-Cr crack free films crack/notch faces cranks creep flow model critical length (#critical strain energy release rate
cross flow $ cross flow micro heat exchanger crosstalk Crucial to long-term stability of neuronal micropatterns is functional retention of the underlying substratum while exposed to cell culture conditions. We report on the ability of covalently bound PEG films in long-term cell culture to continually retar CRYSTAL DOPING crystal etching crystal orientation 0
Campbell, D.J. Campbell, E.W. Campbell, Michael J. Campbell, P.M. Campbell, Paul M. Cane, C. Cannon, D.M. Cao, K. Cao, L. Cardenas-Valencia, Andrws M. Cardinaud, Ch. Cargill, Michele Carlen, E.T. Carley, L.R. Carlin, T.J. Carman, G.P. Carman, Greg P. Carman, Gregory P. Carnahan, D. L.
Carr, D.W. Carr, Dustin W. Carraro, Carlo Carter, Christine Carter, J.C. Carver, Amy Carver, T.E. Carver, Thomas E. Cass, T. R. Castaner, L.M. Cattaneo, F. Cavet, G. Cawley, J.D.
Caymax, M. Center, Angela Cerrina, Franco Cha, G. Chabinyc, M. L. Chakraborty, A. K. Challa, Vinod R. Chan, E.
Chan, E.K. Chan, Mansun Chan, R
Chan, R.T.
Chan, Richard Chan, Wai Pang Chandramouliswaran, Ishwar Chandrasekaran, V. ,&Chang Liu, J. Chen, J. Zou, and Z. Fan chang, Chih-Hao Chang, John C.
Chang, Kai
Chang, Liu
Chang, Max Chang, P. Chang, Shih-Chia chang-Hasnain, C.J. Chang-Hasnain, Connie J. Chao, Norman Chao, R. Chao, Rumin Chapman, Patrick Chapman, Patrick L. Charlab, Rosane
Chasiotis, I. Chasiotis, Ioannis Chaturvedi, Kabir Chatzandroulis, S. Chaudhuri, Swades K Chaudhury, M.K. Chavan, A.V. Chen, Chuan-Hua Chen, Gin-Shin
Chen, H.D. Chen, J Chen, J.
Chen, Jack Chen, Jinghong Chen, Jingkuang Chen, Kuo-Shen Chen, Lin Chen, N.
Chen, N.W. Chen, Nannan Chen, Pang-Wei Chen, Quanfang
Chen, R.T.
Chen, Ren-Haw Chen, S.
Chen, Shea Chen, Terry Yuan-Fang
Chen, Y.N. Chen, Zheng-Yi Cheng, C. H. Cheng, Ming Lai Cheng, Y.-T. Cheng, Y.T. Cheung, Chin Li Cheung, K.C. Cheung, N.W. Chiem, Nghia
Chiesl, T. Chiesl, Thomas Chiesl, Thomas N. Childs, William R. Chilkoti, Ashutosh Chin, K. Chiou, Chi-Han Chiou, Jin-Chern
Chiou, Pei Yu
Chiu, D.T. Cho, Adrian
Cho, D.-I. Cho, Dong-Il Cho, H.J. Cho, Hyoung J. Cho, Il-Joo
Cho, K. J. Cho, S.W.
Cho, Young-Ho Choi, B. Choi, Bo Choi, Hee Cheul Choi, J. Choi, J. W. Choi, J.-W.
Choi, Jin-woo Choi, W. Choi, Yoonsu
Chong, Nui Chou, Hou-Pu Chou, Stephen Y. Choujaa, A. Chow, E.M
Chow, E.M. Chow, Peter Christensen, R. G. Christenson, T. Chrostowski, Lukas
Chu, Jiaru Chu, Z.
Chua, C.L. Chui, B. W.
Chui, B.W. Chun, Kukjin Chung, Hoon-Ju
Chung, Jaewon Chung, S. Chung, S.-W. Chung, Sung-Wook Chung, Taek Dong Churikov, Victor M. Chworos, Arkadiusz
Ciarlo, D. R. Clark S. M. Clark, Andrew G. Clark, J.R. Clark, R. Clark, Randell W. Clark, S.M. Cleghorn, W.L. Cleland, A. N. Clifton, Kwang-Fu Shen Cline, Greg
Coffey, E.
Cohn, M.B. Colbert, Daniel T.
Cole, J.C.
Cole, R.L. Collard, D. Collard, Dominique Collet, Manuel Collier, C. P. Collier, C. Patrick
Collins, S.D. Collins, Steve Comtois, John H. Conant, Robert Conant, Robert A. Connally, J.A. Cooks, R. Graham
Cooper, E. B. Corcoran, C.J. Cordoyiannis, G. Corey, David P. Corey, J. M. Corwin, A.D. Corwin, Jeffrey T. Cote, R. Cote, Richard J. Cowen, A.B. Cox, Edward C. Coyer, Sean Craighead, H. G. Craighead, H.G. Craighead, Harold G. f imaging capabilities imaging tip impact force 0-Impedance and admittance measurement [B7310J] implant-tissue interface implantable applications $ implantable biomedical devices $!implantable multielectrode arrays
impurities impurity states ,&in situ capacitive position correction in situ DC microplasma in situ doping in situ growth in situ measurement in situ position sensing (#in situ residual stress measurement in vitro environment In-Cu in-plane strain sensors in-use stiction in-vivo biomedical monitoring in-vivo measurements incandescent light source inchworm motor design
INCISIVE tips inclined magnetic actuators inclined SU-8 structures indentation indentations independent tuning 0+independently controlled microfluidic plugs $ indirect boundary element method indium compounds 41individual single mode opto-electronic components induced anisotropy (magnetic) induced stress
inductance inductances induction motors (%inductively coupled plasma (ICP) etch inductors Industrial economics industrial equipment Industrial management industrial manipulators inert dielectric liquid infinitesimal machiner information technology infrared absorber infrared bolometers infrared camera infrared detectors infrared imaging INFRARED RADIATION infrared spectroscopy infrared thermal velocimetry infrared transparency InGaAsP-InP initial contact resistance initial polygonal mask shape initiation location injection molding Ink ink jet printers $ ink molecule-water interactions
ink molecules ink wells @;ink-jet printed nanoparticle microelectromechanical systems inkjet printing
inlet chamber
inlet orifice
inlet port inlet pressure inlet/outlet ports INORGANIC CHEMISTRY input power insect-model based design insertion loss insertion losses
inspection insulation layer (#integrable electrostatic microvalve integral structural material integrated acoustic system integrated actuator 0,integrated air-gap-capacitor pressure sensor integrated circuit (#integrated circuit interconnections $ integrated circuit manufacture $ integrated circuit measurement $ integrated circuit metallisation integrated circuit noise integrated circuit packaging $ integrated circuit reliability integrated circuit technology integrated circuit testing integrated circuit yield integrated circuits integrated detection circuit integrated electrodes $ integrated equilibrium equations integrated fluidic channels integrated high-Q coils integrated inductor integrated MEMS technology integrated metal electrode integrated microrelays integrated microsystems 83integrated optical interferometric detection method integrated optics Integrated optics [B4140] integrated optoelectronics ,'integrated packaging-compatible devices 0*integrated permanent magnet microactuators integrated power converters integrated resonators integrated sensor integrated sensor array integrated state sensing (#integrated thermal microtransducers ,&integrated vertical screen microfilter integration capabilities intelligent actuators intelligent materials intelligent sensors interactive design interactive process interconnect resistivity interconnection problems interconnections
interconnects interdigital transducers interdigitated comb drive interdigitated electrodes interdigitated fingers interdigitated transducer interface bubbles interface energy interfacial contact mechanics ($interfacial free energy minimization interfacial region INTERFERENCE INTERFEROMETERS interferometric accelerometer $ interferometric position sensor INTERFEROMETRY interlock intermediate frequency intermediate layer G F
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Maxwell, R.B.
May, David Mayes, P.
Maynor, B. Maynor, Ben Maynor, Benjamin W. Mazurkiewicz, Jakub McCain, S T McCarley, R.L. McCarty, A. McCawley, Steven McConaghy, C.F. McConnell, A.D.
McCormick, RM McCumber, Kim V. McDonald, J. C. McDonald, J.C.
McGall, G. McGray, C.D.
McGruer, N.E. McIntosh, Tina McKendry, Rachel McKenzie, I. McKinnon, G. H. McKusick, Victor A.
McLain, T. W.
McLean, J.
McMullen, Ivy McNeil, V.M.
Meckes, A. Meeusen, Wim Mehra, A.
Mehregany, M. MEHREGANY, MEHRAN Meier, R.E. Meinhard, C.D. Meirovitch, Leonard Melchier, James R. Mello, Andrew J. de Melosh, Nicholas A. Menard, Etienne Mensing, G. Merchant, P. Merhari, L. Merilainen, P. Merkulov, Gennady V. Merlo, S. Merrem, H.J. Mertens, R.
Mescher, M.J.
Messner, W.C. Metallo, S. J. Meyer, Ernst Meyer, M.R. Meyer, Robert G. Mezic, Igor
Mi, Huaiyu Michalet, X.
Michel, B.
Michel, Bruno Michie, W.C. Michielssen, E.
Mickelson, W. Middelhoek, S.
Mignani, A.G. Miki, N. Mikkelsen, Jr., James C.
Milanovic, V. Milanovic, Veljko Miles, M. J.
Miller, A. Miller, Abigail E. Miller, Adam C. Miller, L.M.
Miller, R.
Miller, S. Mills, J.K. Milne, I. Milnes, A.G. Milshina, Natalia Min, Young-Hoon Minamoto, Y. Minch, Bradley A. Mingues, Corinne Minne, S. C. Minne, S.C.
Mirkin, C.
Mirkin, C. A. Mirkin, C.A. Mirkin, Chad Mirkin, Chad A Mirkin, Chad A. Mirkin, Chad. A. Mita, M. Mittal, K.L. Miu, D.K. Miura, H. Miyajima, H. MIZUNO, Hitoshi Mlhave, Kristian Moal, Patrice Le Mobarry, Clark Moet, A. Moffett, Nancy Mohanchandra, Kotekar P.
Mohanty, S.K. Moldovan, N. Moller, Aage R.
Monk, D.J.
Monnom, G. Montemagno, Carlo D.
Moon, F.C. Moon, Hyejin Moore, Alvin W. Moore, Helen M. Moore, J. Moore, J. S. Moore, J.S. Moore, Jeffery S. Moore, Jeffrey S. Moore, R.H. Moorthy, J. Moran, C.
Morgan, B. Morgan, Denny E. Morgan, M.J. Mori, Yuichiro Morikawa, E. Morley Stone, Rajesh Naik
Morrissey, A. Morse, T. F. Motamedi, M. E. Motsegood, K. M. Motsegood, K.M. Mouri, E.
Moy, Linda Moy, Mee
Mracek, A. Mrksich, Milan Muhlberger, S. Muhlstein, C.L.
Mukherjee, S. Mullenborn, M.
Muller, G. Muller, R.S. Muller, Richard S.
Muller, T. Murakami, K. Mural, Richard J.
Muralt, P. Muro, H.
Murphy, Brian Murphy, M.C.
Murugesan, S. Musunuri, Surya Mutlu, S. Myers, Eugene W. Nadal-Guardia, R. Nadeau, Joe Naik, Ashwinikumar K Naik, Rajesh R.
NAJAFI, K. Najafi, Khalil Nakamura, Y.
Nam, J.-M. Nam, J.M. Nam, Jwa-Min
Namazu, T.
Namiki, A. Nannini, A. Narayan, Vaibhav A. Narechania, Apurva Naseh, S. Nassiopoulou, A. G. Nassiopoulou, A.G. Nathanson, Harvey C. Neagu, C.R. Nealey, Paul F.
Nedelescu, L.
Neelam, Beena Negri, A. Nelson, Catherine
Nelson, Clark
Nelson, Keith
Nelson, RJ Nemirovsky, Y. Neudeck, Gerold W. Neugroschl, Daniel
Neukomm, P.A. Neves, Hercules P. Nevin, J.H. Newell, William E. Newnham, Robert E. Ng, K.-Y. Nguyen, C.T.-C.
Nguyen, H. Nguyen, H.D. Nguyen, Hung Nguyen, Nam-Trung Nguyen, T.C. H. Nguyen, Tu-Cuong H. Ni Niarchos, D. Nicholls, H.R. Nick Holonyak, Jr. Nickel, J.G. Nicolson, Teresa Nijdam, A.J. Niklaus, F. Niknejad, A.M. Niles, L.C.
Nilsson, J Ning, Gu Nishida, T. Nishihara, Motohisa Nitzan, Abraham Niu, Meng-Nian Nix, W. Nix, William D. Noor, Ahmed K.
Norgia, M. Norris, D.J. s VERY HIGH TEMPERATURE very low dependance $!very-large cross-connect switches VHF VHF devices @:VHF free-free-beam flexural-mode micromechanical resonator ($vibrating micromechanical resonators vibrating sample magnetometer vibration vibration measurement vibration microsensors vibration sensors vibrational heating
vibrations vibratory accelerations vibromotor precision Vickers hardness
video display
virtual valve viscometers $ visible optical readout system VISIBLE RADIATION vision VLSI electromechanics voided regions Voigt and Reuss bounds volatile fluid volatile organic compounds voltage bias voltage difference voltage pull-in point voltage-controlled oscillator $ voltage-controlled oscillators volumetric flow rates von-Karman equations W
wafer bonding wafer geometry wafer level wafer level packaging wafer scale wafer scale packaging wafer thickness (#wafer through-hole interconnections wafer-bonding technology (%wafer-level in-registry microstamping ,'wafer-level transfer bonding technology $ wafer-scale continuous membranes wafer-scale integration (%wafer-scale membrane transfer process wafer-scale processing wafer-to-wafer bonding WAFERS wait time ("wall temperature distribution data warping member wastewater reduction water condensation water detection
water flow water ingress points water meniscus water rinse water soak tests water supply $ water transmission experiments wave number wave optics WC-Co
WC-Co gear weak electrolyte solutions weakly nonlinear MEMS devices wear wear rate wear studies wear testing Weibull distribution Weibull statistics wet anisotropic etching wet chemical etching wet etching wet thermal oxide wet wafer cleaning wet-chemical etching Wetting wetting properties wetting tips Wheatstone bridge white noise white-light interferometry whole-field optical read-out wide band gap semiconductors wide-bandwidth accelerometer 0*wide-bandwidth electromechanical actuators WIMS wireless communication wireless front-end circuit $!wireless implantable microsystems $!wireless integrated micro-systems $ wireless integrated microsystems 4.wireless micromachined ceramic pressure sensor wireless monitoring wireless power supply wireless telemetry wireless telemetry scheme wobble work density write speed writing capabilities
writing modes X-ray diffraction 0*X-ray diffraction examination of materials
X-ray effects $ X-ray lithographic exposure tool X-ray lithography X-ray lithography lathe
X-ray mask X-ray sensitive resist X-ray transmittance x-y stage XeF2 XPS XRD XRD pattern 0*YBa2Cu3O7 yield yield enhancement yields
Young modulus Young's modulus ,'yttria-stabilized zirconia buffer layer zinc zinc compounds zinc negative electrode ZINC OXIDES Zn ZnO ZnO films ZnO-Si $ ZnO-Si3N4
ZnO-SiN-Si {100} planes {101} planes {111} planes DAportable battery-operated multisensor instrumentation microsystem $!portable clinical diagnostic kits portable display portable fuel cell system position control position dependence position sensor positive photoresist post-etch mechanical behavior postprocessing sequence powder blast powder blasting powder particle erosion power power consumption power delivery
power density power dissipation
Power MEMS 0+power microelectromechanical systems (MEMS) power sensitivity ,&power source, bio fuel cell, fuel cell power supplies to apparatus power supply $!pre-charge voltage bias technique (%pre-fabricated CMOS control circuitry preamplifier
preamplifiers precision cutting precision engineering precision optics preconcentration factors PRECURSOR ("predictable microfluidic actuation predicted bandwidth preferential magnetization preferred nucleation sites premature failure pressure pressure amplification pressure conductive rubber pressure control pressure dependence pressure difference pressure distributions
pressure drop pressure drop data
pressure feed
pressure head $ pressure inverter logic circuits pressure inverting amplifiers
pressure loss pressure measurement pressure monitors pressure response time pressure sensing pressure sensor pressure sensor chips pressure sensors pressure system pressurized air detonation pressurized chamber $ previously deposited molecules Printers (computer) printing probability of sealing D@Probability theory, stochastic processes, and statistics [A0250] probe arrays
probe density probe thickness Probes process compatibility process design process flow process heating process optimization process parameters process schemes processing conditions processing temperature production yields Professional aspects ($profile independent flow measurement profilometry projection display projection display systems projection displays projection engine optics
proof mass proof mass fabrication proportional relation proportionality factors 40Prosthetic and orthotic control systems [C3385C] prosthetics ("Prosthetics and orthotics [B7520E] protective coatings protective layer 0*protein micro array, microarray of protein <6protein micro array, microarray of protein, dispensing protein nanoarrays generation protein nanostructures protein patterns @=protein-resistant oligoethylene glycol-terminated alkanethiol Proteins proximal probes proximity sensor PSPICE Pt
Pt-SiO/sub 2/ pull-in analysis pull-in instability pull-in parameters pull-in reproducibility pull-in voltage pulse control RC circuit pulse discharge circuit pulse duration pulse durations pulse generation pulse width modulation pulsed Lorentz forces ($pulsewidth modulation control method pump power fluctuations pump wavelength pumps PVDF PVDF sensor pyramidal diamond tip pyramidal hillock shapes
pyramidal tip
Pyrex 7740 pyrex glass pyrex glass cover Pyrex glass plates pyrolysis PZT PZT film PZT sol-gel thin film PZT thick film Q-factor Q-factor enhancement Q-factor measurement Q-factors quadratic stiffness
quadrupole quality quality factor quality factors Quantum dots $ quantum-mechanical transitions quantum-mechanical tunnelling quarter-wavelength coupling 0+quarter-wavelength impedance transformation quartz quartz crystal microbalance quartz microresonators quartz substrate quartz substrates quasistatic responses ' ~ j microcantilever array microcantilever beams microcantilever impacter
microcavities
microchambers microchannel microchannel fabrication microchannel plates
microchannels microchip fabrication Microcontact printing microcontact printing, nano LFmicrocontact printing, nano, deformation of stamp, deformation of PDMS 4.microcontact printing, nano, etching, ITO, ZnO <7microcontact printing, nano, flat stamp, contact inking ,(microcontact printing, nano, hot CP, ITO 4/Microcontact printing, nano, on silicon, direct 83microcontact printing, nano, protein, cell adhesion LGMICROcontact printing, nano,selective growth, organic polymer, Parylene microdischarge, plasma microdisplacement actuator microelctromechanical systems 0*microelectric impedance measurement system microelectrode arrays microelectrodes microelectroformed metal microelectromagnet 83microelectromechanical deformable optical component microelectromechanical device $ microelectromechanical devices microelectromechanical filter 85microelectromechanical intermediate frequency filters $ microelectromechanical sensors $ microelectromechanical structure microelectromechanical system $ microelectromechanical systems (%microelectromechanical systems (MEMS) ,)microelectronics packaging infrastructure microengine $ microfabricated floating-element 84microfabricated floating-element shear-stress sensor microfabricated inductors ,'microfabricated preconcentrator-focuser microfabricated probes microfabricated structure microfabricated structures microfabrication microfabrication method microfabrication process microfabrication technique microfabrication techniques microflight mechanisms microfludic
microfluid ,(microfluid, bioprocessor, drug discovery 0+microfluid, microfluidics, nanofluid, fluid $!microfluid, mixer, chaotic mixing microfluidic microfluidic channels microfluidic components microfluidic device microfluidic devices microfluidic flow $ microfluidic integrated circuits microfluidic microchannel ("microfluidic optical fiber devices microfluidic packaging microfluidic pump microfluidic sensor microfluidic system microfluidic systems
microfluidics $ microfluidics, DNA, microfluid microgear microgravity accelerometer microgripper microheat sink microheater microheater surface area $ microhotplate chemical sensors
microinductor microinductors microinstrument microlenses microlinear slider microlithography microlocomotion ($micromachined acoustic sensor arrays micromachined actuators micromachined battery micromachined bimorph 0+micromachined biodegradable microstructures micromachined cantilevers micromachined cart micromachined cavities micromachined components (%micromachined conductive polymer bump ,µmachined conductive polymer bumps $ micromachined deformable mirrors micromachined devices micromachined diaphragm ,(micromachined dry biopotential electrode ("micromachined impact microactuator micromachined inductors (%micromachined magnetic-bar micromixer micromachined microgimbals $ sacrificial gap sacrificial gaps sacrificial layer sacrificial layer etching sacrificial layer technique sacrificial layers sacrificial oxide layer sacrificial photoresist layer ,)sacrificial photosensitive polycarbonates sacrificial release layer $!sacrificial SiO2 layer $ sacrificial SiO2 mold sacrificial spacer material sacrificial wafer bonding sacrificial-layer method $ sacrificial-layer micromachining sacrificially thinning saline solution SAM coating
sample age sample flow sample injector sample preparation sampling frequency SAMs $ sandwich molding configuration sapphire satellite droplets saturation flux density scale scale effect scan angle control ($scanning electron microscope imaging scanning electron microscopy DAscanning ion conductance microscopy (SICM), protein, DNA, pipette scanning micromirrors scanning mirror ,&scanning near-field optical microscopy ($scanning optical confocal microscopy scanning probe instruments scanning probe lithography scanning probe method scanning probe microscopy <8Scanning probe microscopy and related techniques [A0779] D?Scanning probe microscopy determinations of structures [A6116P] $ scanning probe microscopy device scanning speed scanning thermal profilometer scanning tunneling microscope $ scanning tunnelling microscopy scientific instruments scratch drive actuator scratch drive actuators scratch tester SCREAM process SCREAM-II screen printing screen-printed disk magnet sealed cavities
sealed cavity ("sealed surface micromachined patch sealing sealing diaphragm sealing status seals (stoppers) secondary cells $ Seebeck coefficient measurement Seebeck coefficients Seebeck effect
seed layer seismic mass seismic masses selective condensation selective deposition selective electroforming selective electroless plating selective etching selective oxidation selective response
Self assembly
self-align ,&self-aligned electrostatic comb drives self-aligned ink feed hole self-alignment self-alignment technique self-assembled monolayer $ self-assembled monolayer (SAM) self-assembled monolayer film ("self-assembled monolayer formation Self-Assembled Monolayers SELF-ASSEMBLED MONOLAYERS, ALKANETHIOLATE MONOLAYERS, GOLD, SILVER, DNA, NANOPARTICLES, PHOTOOXIDATION, PROBES, Lithography, nano-, dip-pen Nanostructuring Oligonucleotides Ordered arrays, 2D $ self-assembling monolayer films
Self-assembly self-biasing self-caging proof masses self-calibrated self-consistent simulation <6self-consistent three-dimensional numerical simulation self-organization self-resonance frequency (%self-stabilizing temperature gradient SEM semi-amorphous film semi-rigid backplate semicircular shape semiconducting substrates <9semiconductive chemical-vapor-deposited diamond thin film
semiconductor $ semiconductor batch processing $ semiconductor device measurement semiconductor device models semiconductor device noise $ semiconductor device packaging $ semiconductor device reliability semiconductor device testing SEMICONDUCTOR DEVICES SEMICONDUCTOR DIODES semiconductor doping semiconductor films semiconductor growth ("semiconductor insulator boundaries ,)Semiconductor integrated circuits [B2570] semiconductor junction lasers semiconductor lasers semiconductor manufacturing Semiconductor materials $ semiconductor optical amplifier $ semiconductor optical amplifiers semiconductor plasma 83semiconductor polymeric piezoelectric microactuator $ semiconductor process modelling 3 # Northrup, M. Allen Northrup, M.A.
Norton, P. Norville, J. Notterman, D.A. Nouet, P. Novotny, L. Noy, A. Noy, Aleksandr Nunes, Ronald W. Nusskern, Deborah Nuzzo, Ralph G. Nyamjav, Dorjderem Oberhammer, J.
Obermeier, E. Oden, P. I. Odhner, J.E. Oe, K. Oh, Chang Hoon Oh, K.W. Oh, Kwang W Ohadi, M. Ohmichi, O. Oijen, Antoine M. van Okamoto, Kuniaki Oki, T. Oliver, Justin C. Olkhovets, Anatoli G.
Ollmar, S. Olsen, M.G.
Olsson, A. Olthuis, W. Omodaka, A.
Ondaruhu, T. Ono, T. Oosterbroek, R.E. Oralkan, O. Oroudjev, Emin Orvis, W. J.
Oshima, K.
Osterberg, P. Ostrom, N P Ostrom, N.P. Ostrowsky, D.B. Ostuni, Emanuele Otter, B.
Ouyang, Zheng Oz, Altug Paegel, Brian M
Pagonis, D.N. Pan, Chi Shiang Pan, Li-Wei
Pan, Yingtian Pandraud, G. Pandya, Saunvit Pang, Jiangtao
Pang, S.W. Panina, Larissa V. Pannetier, Myriam
Papautsky, I. Papra, A.
Paranjape, M. Pardo, F.
Pareek, A. Pargellis, A.N.
Park, J.Y. Park, Jae-Sung Park, Jung-Hwan Park, K.-H. Park, Ki-Tae
Park, Kyihwan Park, S-J Park, S. W. Park, S.-I. Park, S.-J.
Park, S.J.
Park, Sangjun Park, SanTae
Park, So-Jung Park, Sungho
Park, Sungmee Parker, G.H. Parmentier, B. Parpia, J.M.
Partridge, A. Pascal-Delannoy, F.
Pathak, Rajiv Patridge, A. Pattekar, A.V. Patterson, Charles H. Patterson, P.R. Patterson, Pamela R. Paul, O. Paul, O. M.
Paulus, A. Paulus, Aran Pavot, Caroline M.-B. Pawlowski, A.-G. Payne, Beverly
Pearce, T. M. Pederson, M. Pedotti, A. Peeters, E.
Peignon, M.C. Peles, Y. Peltonen, Leena Pelz, G. Pena, David J. Peng, Shu Pennisi, Elizabeth Perazzo, T. Perch-Nielsen, I. R. Perkins, F. Keith
Perkins, F.K. Perreault, J.A. Perreault, Julie A.
Peter, Gwynne Petersen, K. E. Petersen, K.E. Petersen, Kurt E. Petroff, Pierre M. Pfafman, T. Pfann, W.G. Pfannkoch, Cynthia
Pham, N.P.
Phinney, L.M. Pierret, Robert F.
Pinaud, F. F. Piner, Richard D.
Ping, Zhiming Pique, A. Pisano, A.P. Pisano, Albert P. Pister, K. S. J. Pister, K.S.J. Pister, Kristofer S. J. Piyawattanametha, W. Piyawattanametha, Wibool Piywattanametha, Wibool Plaza, J. A. Plaza, J.A. Plettner, A.
Podosek, J.A. Podzorov, Vitaly
Poenar, D.
Pohl, D.W.
Pohl, H.A. Polla, D.L. Pommier, C. Pong, K. Pons, P. Poon, Tze Wing Pornsin-Sirirak, Nick Porter, Lon A. Postma, Henk W. Ch. Poucques, L. de Poulsen, C. R. Pourciel, J.B. Pratts, Eric Prausnitz, M.R. Preissig, F. J. von Preissig, Fred J. von Prentiss, Mara Protz, C. Puers, R.
Puers, Robert Puntambekar, A. Purdy, S. Puri, Vinita Pyle, J.
Qi, Baohua Qi, Pengfei Qi, S. Qian, Xin Qiao, Q. Qin, D. Qin, Dong
Qu, Jia-Jiunn Quake, Stephen Quake, Stephen R.
Quandt, E. Quate, C. F. Quate, C.F. Que, Long
Qureshi, Hina Raab, Anneliese
Rabbitt, R.D. Rabe, K. M. Rabolt, J.F.
Racine, G.-A. Rada, M. Radwin, R.G. Rajan, N. Rakow, Neal A. Raley, N.F. Raley, Norman F. Ramachandran, S. Ramsey, J. Michael Ramsey, P.B. Rao, D. V. G. L. N. Rao, Nannapaneni Narayana Rao, Saleem Raphael, Marc P.
Raptis, I.
Rasmussen, A. Rasmussen, Anne Marie Rasmussen, D.H. Ratner, Mark Ratner, Mark A. Ratner, Mark. A. Ravi, T. S. Ravula, S.K. Rawson, E.G. Rayment, Trevor Raymo, F. M. Reardon, Matthew Rebeiz, Gabriel M. Reches, Meital D( : 8 - @ x x Ryu, Kee S.
Liu, Chang
2002 \ VPrecision Patterning of PDMS Thin Films: A New Fabrication Method and Its Applications H A6th International Symposium on Micro Total Analysis System (TAS)i Nara, Japan 3-7 November 2002 PDMS
microfluidic present a novel fabrication method for patterning PDMS thin films on solid surfaces. The method allows microstructures with precise lateral dimensions and heights to be formed using PDMS. We have applied this technology to form microfluidic channel units, reaction chambers, and micro elastic gaskets. This new fabrication method could potentially give rise to an efficient and reliable approach of constructing microfluidic systems. . 'Ryu, Kee Suk
Shaikh, Kashan
Liu, Chang.
2003 l eMicro Magnetic Stir-bars Integrated In Parylene Surface-micromachined Channels For Mixing and Pumpingr nThe Seventh International Conference on Miniaturized Chemical and Biochemical Analysis Systems (microTAS 2003) e
/[ " Squaw Valley, California USA October 5-9 , &Ryu, Kee Suk
Shaikh, Kashan
Liu, Chang
2003 n gA Method To Monolithically Integrate Elastomer O-rings on Parylene Membranes For Improved Valve Sealing\ nThe Seventh International Conference on Miniaturized Chemical and Biochemical Analysis Systems (microTAS 2003) e
/[ " Squaw Valley, California USA October 5-9 Ryu, K.
Shaikh, K.
Liu, C.
2003 n gA Method To Monolithically Integrate Elastomer O-rings on Parylene Membranes For Improved Valve Sealinga t nThe Seventh International Conference on Miniaturized Chemical and Biochemical Analysis Systems (microTAS 2003) " Squaw Valley, California USA
(accepted) h aKee Suk Ryu
Xuefeng Wang
Kashan Shaikh
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Edgar Goluch
Jun Zou
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Chad A. Mirkinh
2004 L FIntegrated microfluidic inking chip for scanning probe nanolithography Applied Physics Letters=
AIP 85 1 136-138e 2004/07/05/ V Opolymer films
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2004 R LA method for precision patterning of silicone elastomer and its applications B ;IEEE/ASME Journal of Microelectromechanical Systems (JMEMS) 13 4 568-575 Kee Ryu
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2004 R LMicro Magnetic Stir-bar Mixer Integrated with Parylene Microfluidic Channels
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2004 L FIntegrated Microfluidic Inking Chip for Scanning Probe Nanolithography F @The 11th Solid State Sensor, Actuator, and Microsystems Workshop Hilton Head Island, SC
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laser beam LASER BEAM APPLICATIONS laser beam etching laser cavity resonators laser characteristics laser diode laser interferometry laser irradiation Laser machining laser materials processing laser measurement system LASER RADIATION laser tuning laser velocimetry
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ON COATING on-chip biochemical analysis on-chip circuit on-chip circuitry on-chip CMOS circuits $!on-chip electronics compatibility (%on-chip high-and reference oscillator on-chip microvibromotors on-chip power source on-off nozzles oncology 0,one degree-of-freedom microsuspension system one side lithography one-dimensional model $ one-dimensional numerical model ,&one-step LPCVD porous polysilicon film open-cavity packages open-loop sensitivity operating conditions operating voltage operation operation frequency operational analysis operational lifetimes operational temperature
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optical fiber optical fiber length optical fiber switch OPTICAL FIBERS optical fibre couplers optical fibre fabrication optical fibre filters optical fibre losses optical fibres
optical films optical filters optical flatness optical focusing optical force control optical input/output coupler optical interconnection optical lever method
optical links optical lithography Optical materials optical MEMS optical micro mirror Optical microscopy optical modulation
optical noise optical polymers optical profilometry optical projectors optical pumping optical quality membranes optical scan angle optical scanner optical scanners optical sensors optical spectrometer optical spectroscopy OPTICAL STORAGE optical switch optical switch matrix optical switches optical switching OPTICAL SYSTEMS $!Optical Time Domain Reflectometry $!optical time-domain reflectometry optical transducers optical transmitters optical transparency optical trap optical trapping optical tuning optical tweezers optical variables control 82optically active arbitrarily shaped nanostructures optically driven micromachine ("optically transparent applications optimal design optimal device design optimisation Optimization optimized structure optimum annealing conditions $ optimum implantation conditions @ Z >
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Bergqvist, J. Bergstrom, P.L. Bergveld, P. Berlin, D.E. Bernard, A. Bernard, Andre Bernard, Andr Bernhard, J. Bernhard, Jennifer Bernhard, Jennifer T. Bernhardt, Anthony F.
Bernstein, J. Bernstein, J.J. Berthold, John W.
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Buhler, J.
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Bullen, David Bullen, David A. Burchard, J.
Burg, T.P. Burger, G.J. Burgett, S. R. Burghammer, Manfred Burghartz, J.N. Buriak, Jillian M. Burke, D.T. Burke, David T. Burns, D.W. Burns, M.A. Burns, Mark A. Burrows, Paul E. Busam, Dana Busch, P.A. Busch-Nentwich, Elisabeth Bustillo, J.M.
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Calmes, S. Camarero, Julio A. Camarota, B. x8 , %Xuefeng Wang
Jonathan Engel
Chang Lius
2003 H ALiquid Crystal Polymer (LCP) for MEMS: Processes and Applicationsf 4 .Journal of Micromechanics and Microengineering 13 5 628-633 SeptemberW $ polymer MEMS, polymer, sensor In this paper we discuss newly developed microfabrication methods for liquid crystal polymer (LCP). LCP is a thermoplastic polymer made of aligned molecule chains with crystal-like spatial regularity. It exhibits unique electrical, physical and chemical properties, making it suitable for certain MEMS applications. MEMS-compatible fabrication processes such as metallization, plasma bulk etching and thermal bonding have been developed in our work. We demonstrated two micro sensor applications involving the LCP material.s ^ XWang, Xuefeng
Ryu, Kee S.
Bullen, David A.
Zou,Jun
Zhang, Hua
Mirkin, Chad A.
Liu, Chang
2003 & Scanning Probe Contact Printingb Langmuir $ American Chemical Society, USA 19 21 8951-8955y Octoberp 16 Englishp " 9/6/03 This paper reports a scanning probe contact printing (SP-CP) method for generating submicron patterns. It uses a novel scanning probe with an integrated elastomeric tip to transfer chemical materials onto a substrate.TheSP-CPmethodcombines the advantages of microcontact printinganddip-pen nanolithography to generate monolayer features chemisorbed on a gold surface. Arbitrary, connected features such as lines or blocks can be formed by connecting multiple dots, analogous to dot-matrix printing. We discuss the design and fabrication of the novel probes for SP-CP and how they can be used to generate sub-500-nm dots and lines of 1-octadecanethiol on a gold surface.e H Bhttp://pubs.acs.org/cgi-bin/asap.cgi/langd5/asap/pdf/la034858o.pdf ':3Micro and Nanotechnology Laboratory, Department of Electrical and Computer Engineering, University of Illinois at Urbana-Champaign, 208 North Wright Street, Urbana, Illinois 61801
Department of Chemistry and Institute for Nanotechnology, Northwestern University, 2145 Sheridan Road, Evanston, Illinois 60208t L [
crystal resonators crystalline plane crystalline Si $ crystalline Si tilting mirrors crystallization $!crystallographically defined tips Cu Cu conductor lines Cu electrode array Cu sacrificial layer Cu-Si cubic restoring forces cubic spring curing curled-hinge comb drives current drive methods current pulses CURVATURE curvature compensation curved cantilever beam curved substrate
curved tip curved-compliant structure 85custom multicomponent nanoscale surface architectures custom-made glass capsule CVD CVD coatings CVD oxide CVD polysilicon film CVD sealing materials cycling frequencies cylinder cylindrical core cylindrical objects DAMAGE damage accumulation
damping holes data reading data retrieval methods data storage data tables data writing DC bias DC magnetron sputtering DC saturation current dc voltage reference DC-DC power convertors DC-DC voltage converter DDMS ("debate about molecular electronics debinding decomposition temperature ($dedicated heat distribution contacts deep anisotropic etching deep corrugation deep reactive ion etch Deep reactive ion etch (DRIE) $ deep reactive ion etched silicon deep reactive ion etches deep reactive ion etching deep RIE
deep trenches deep X-ray lithography deep-reactive ion etching $ Deep-reactive ion etching (DRIE) defect density defects
deflection deflection characteristics deflection range deformable micromirror array deformable mirror degenerate band split degree of fluctuation deionized water delamination dendrimer inks
dendrimers dendritic material dendritic structure dense hybrid integration
densification densitometer dentistry
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